The photochemical machining is the process of metal removal in which light and photo sensitive mask are used to select the intended areas and to apply machining. To develop the transistors and integrated circuits (IC) and parts in Micro-Nano dimensions, precision chemical machining technology is used. Photo mask pattern in chemical machining method and negative film in photochemical machining method are used for projecting an object image on the work piece surface. These two methods are expensive as they require extra cost to develop photo mask pattern and negative film for each work piece. To overcome these problems and to reduce the cost, a new method is presented in which the image is projected on the work piece without using a photo mask pattern or a negative film. In this optic system, ultra violet (UV) light is produced and projected and after paralleling by polarized lenses, the light is passing through a particular computerized image processed plate. Therefore, the imaged UV light is projected on the work piece surface after passing special optical lenses. This particular optic system is connected to a computer, through which the displayed image on the computer monitor is transferred to the optic system. Finally, high patterning resolution around 4 micrometers is obtained by using this optic system as a photomask. Keywords Photochemical Machining, Micro-Nano machining, photo mask, optic system