In the current study, copper coatings were succesfully deposited on steel substrates by thermal spraying for electrical and thermal conductivity applications.The commercially available copper powder particles were used for deposition by a HVOF system using three different fuel/oxygen ratio.The powder size distribution was measured by laser diffraction method. After deposition, coatings were seperated from substrate and the morphology and microstructure of the coatings and initial copper powders were evaluated by optical and scanning electron microscopy (SEM). The X-ray diffraction pattern (XRD) of copper powder and coatings were utilized to determine phase composition and the residual stresses induced during deposition. Oxygen content of coatings was determined by LECO-T300 oxygen determiner. The thermal conductivity of coatings was measured in two directions, through thickness (TT) and in-plane (IP) by laser flash apparatus. The electrical resistivity of coatings was measured in the same directions by the four-point probe method. Cross section microstruccture of coatings revealed the general defects of thermal spray coatings such as pores, intersplat cracks and diffusion bonding between splats. Oxygen content of coatings was two times higher than that of copper powder. The thermal and electrical conductivity of coatings were different in-plane and through thickness of the coatings. Image analysis revealed that the number of splats are different in two directions and as the number of splats changes in one direction, the thermal and electrical conductivity changes. Thermal and electrical conductivity of coatings improved after annealing for 6 hours at temperature of 600 °C. The grain size within the splats became larger after heat treatment indicated that recrystallization accured during heat treatment. This recrystallization was due to existance of the high amount of strain energy i the coatings. Annealing can relief the effects of particle strains that have been created during the coating process. It concluded that splat interfaces were the prominent phenomena for decreasing the thermal and electrical properties. Moreover residual strains and the grain structure within the splats were the other sources for decreasing properties. Key words: Copper coatings, HVOF, Anisotropy of properties, Thermal conductivity, Electrical resistivity