In this study, two different methods of plastic deformation including: a) accumulative roll boning (ARB) and b) continual annealing and roll bonding (CAR) processes were used for the fabrication of copper- silicon carbide composite. ARB and CAR processes were applied successfully for nine cycles on the Cu strips and SiC particles were distributed between them. Peeling test was utilized for the evaluation of bond strength between copper layers and effective parameters on it. Fracture surfaces of the layers after the test were studied by optical microscopy and scanning electron microscopy. Furthermore, the quality of bonding and distribution of powder between layers in composite samples during production process were investigated by optical microscopy. Equiaxed tensile and vickers hardness tests were carried out for the measurement of mechanical properties of the samples. Also scanning electron microscopy was applied for the determination of fracture mechanism of the samples after the tensile test. Texture parameter was investigated by X-ray analysis. Electrical resistance of samples was measured by four probe instrument. For crystallite size determination of samples produced by ARB and CAR processes, rietveld method and MAUD software were used. The results indicated that when the cycles number of processes was increased, the porosities were decreased and the bonding quality between the layer of copper strips were increased. Also, the distribution of SiC particles in the Copper matrix was improved by increasing the number of cycles. Morever, the tensile strength of produced composites was enhanced by proceeding the process and finally reached to 483 MPa, after nine cycles. Elongation of composite samples; decreased dramatically in the first step of composite production by ARB and CAR processes, but it improved by proceeding the process till ninth cycle. Investigation of fracture surfaces after tensile test by SEM revealed that the failure mode in produced composites by both ARB and CAR processes was of the shear ductile rupture type. Studying the texture of the samples showed that for samples produced by CAR process, the dominant texture is (111), while for samples produced by ARB it is (100). Electrical resistance of the annealed raw copper and composites produced by CAR and ARB processes was equal to 48, 69 and 61 µ?, respectively. The crystallites size that measured by MAUD software for copper and the composite produced by nine cycles of ARB process reached to 111 nm and 89 nm, respectively. The results of mesurments by rietveld method were compared with findings of the other researchers. Therfore, it was obvious that the grain size of produced composite by ARB process is less than 100 nm. Keywords : copper- silicon carbide composite, Accumulative roll bonding (ARB), Continual annealing and roll bonding (CAR), Bond strength, Microstructure, Mechanical properties, Fractography, texture parameter, electrical resistance, Reitveld method.