Ultrasonic Consolidation is a solid state additive manufacturing process. In this process, thin metal foils are welded together by using high frequency vibration energy under pressure to create a metallurgical bond without melting the base material. In Ultrasonic Consolidation, bonding would be created in a temperature below 50% of metals/nickel's melting point. On the other hand, Electroforming is an electrodeposition proce similar to electroplating. Electroforming is the production or reproduction of specimens by electrodeposition upon a mandrel or mould that is subsequently separated from the deposit. It's noticeable that Electroforming is economically suitable for foil production. Furthermore, the capability of Electroforming to produce foils with fine surfaces are not negligible and surface roughness can change friction coefficient. Moreover, it is commonly believed that, in Ultrasonic Consolidation process, friction at the mating surfaces plays an important role in the bonding process by removing surface contaminants and producing adequate plastic strain to bond two adjacent foils to each other. Therefore, in this investigation, founding a novel hybrid manufacturing process based on these two processes was studied. So it was examined if electroformed nickel foils could be bonded by Ultrasonic Consolidation. First, nickel foil samples with 100-150 micrometer thickness were produced by Electroforming. Sulphamate solution with 2.7A/dm 2 current density was used to obtain the best achievable roughness on foil. Afterward, a number of mechanical properties of fabricated foils including friction coefficient were measured. A custom-fabricated tribometer was designed and made to measure friction coefficient values in ambient and elevated temperature. Results show that friction coefficient increases by temperature elevation, up to 150 O C and after that it decreases, up to almost 200 O C. then, within temperature elevation friction coefficient value doesn’t change, up to 370 O C. Finally, a set of experimental tests were conducted, by applying a 10 micrometer amplitude and 20 kHz frequency vibration, to predict the effect of applied vibration in foils interface. The results of Ultrasonic Consolidation tests support creation of bonding between electroformed foils by applying a 700W ultrasonic vibration after 0.1 second but this bonding wasn’t continues, because the used tool could not roll during applying vibration. Consequently, welded region was line shape. Therefore, after cutting the bounded interface bounded region couldn’t be seen by an optical microscope. So it was concluded that the bonding was not due to merger of two adjacent foils' atoms and it's maybe created by mechanical interlocking. The other hypothesis is that during cutting the interface, the bonded area was damaged and couldn’t be seen later by a microscope. Since the strength of bonding was significant and mechanical interlocking couldn’t make such a strong bonding, the later hypothesis is more probable. Additionally, it should be noticed that it was proved that by using foils with rougher surfaces, due to decrease of friction coefficient, no bonding was occurred. Keywords: Electroforming, Ultrasonic Consolidation, nickel foil, bonding, Tribometer