Tin-lead eutectic alloy (Sn-Pb) is commonly used for soldering joints in electronic components. In recent years the use of tin-lead solder alloys has been limited due to environmental problems, and many researches have conducted to develop lead-free solder alloys. owadays, the use of Lead has been banned by environmental laws due to high levels of Lead poisoning. For high reliability applications in electronic equipment, Lead-free nanocomposite solders have been fabricated by a different methods including melting and powder metallurgy. However, the use of nanoparticles has been limited due to issues such as agglomeration and particle oxidation. A good approach to improve the reliability of joints in electronic devices is to use composite solders. Composite solders have high joining reliability because reinforcement particles can control grain growth, increase grain boundaries and control the formation of intermetallic compounds in the solder matrix. In this study the fabrication of Sn-0.6Al eutectic solder and Sn-0.6Al-X%D(X=0.5,1,1.5) nano-composite solder were investigated by cumulative extrusion solid state method. Nanoparticles of electric arc furnace dust from Esfahan’s Mobarakeh Steel Company were used as reinforcement. Lead-free solder specimens were examined by X-ray diffraction (XRD), X-ray diffraction energy spectroscopy (EDX). Density, electrical resistance, microhardness, tensile strength, and shear strength of the specimens were measured. The results show the microstructural properties of Sn-0.6Al eutectic solder using cumulative extrusion, crack and cavity with increasing percentage of Dust nanoparticles. Results showed that the addition of aluminum controls the growth of the ?-Sn phase and also leads to increment of the grain boundary in the tin matrix. To assess the alloying process of Al and Sn in matrix differential Scanning calorimetry (DSC) test was carried out. Contact angle of solder with the copper substrate was performed by drop test. The wetting angle of Sn-0.6Al solder were measured 37°. The density of nanocomposite solders was obtained by Archimedes method. About 19% of the solder joint weight can be reduced by using Sn-0.6Al-1%D compared to Sn-37Pb solder. The electrical resistance of the solder specimens were measured using a four-propeller device. Results showed that the electrical resistance of Sn-0.6Al/D nanocomposite solder are comparable to Sn-Ag-Cu and Sn-37Pb. Mechanical results showed that adding one percent of nanoparticle reinforcement leads to improvement of shear strength, tensile strength and micro-hardness of -0.6Al eutectic solder. key words: Cumulative extrusion, Nanocomposite, Solder, Lead-free solder, Physical properties, Mechanical properties.