: With the development of Micromachining and microelectronics in recent years, microwaves have found many applications. Microheaters are used in a variety of applications, including gas sensors, humidity and pressure sensors, infrared detectors, conductive ink printing, thermal actuators, and military applications. Many efforts have been made to improve the uniformity of heating and reduce the power consumption of microheaters using structural modification. The most common of these are microheaters with platinum and polysilicon heating elements on the silicon oxide layer. These microheaters have good performance and low power consumption; However, the presence of residual stresses between layers in the coating process (due to differences in the amount of thermal expansion coefficients of the selected layers and also the presence of high stresses in different coating processes) reduces the useful life of the microheater and heat loss. To the substrate layer, reduces the heat concentration in the heating element at high temperatures. The aim of this project is to design and build a microthermal with micron MicroCavity with nickel structure on the gold-chrome layer. The construction method of this project is electroplating process. This microheater is used for high temperature applications such as gas sensors and conductive ink printing. In the simulation section, the goal is to find a suitable geometry for the heating element to distribute and aggregate heat uniformly with power consumption and response time. The heating element is made of nickel and the working temperature of the microheater is 350 to 400 ° C with an input voltage of 2.5 volts. The simulation results show that the height of the heating element to reach the desired temperature is 40 microns and the response time is 20 milliseconds. A microCavity array was used on the back of the microheater to reduce heat loss to the substrate. The bottom-up microheater structure consists of a silicon substrate, a silicon oxide layer, an intermediate layer of chromium and gold, and a heating element. Microheaters are designed and manufactured based on standard micromachining methods. The silicon oxide layer is deposited by the dry oxidation process, the chromium and gold layers by the electron beam machining method, and the nickel layer by the electroplating method. In the microheater test section, the obtained results confirm the simulation results and show that the microheater has a good performance in terms of production temperature, power consumption and response time. Keywords: Microelectromechanical systems, Microheater, Power consumption, Electroplating, Deposition, MicroCavity, Substrate