: The efficiency of electronic components has significantly increased the growth of technology in the world. Cooling optimization is one of the efficient parameters which affected the performance of electronic components. The advantages of using Micro channels as a heat sink for everyone is obviuse. Strength segment is another parameter to minimize electronic components requirement with influencing the performance of the electronic components. Owing to manufacture restrictions of electronic components and immense heat generation in the electronic component, and investigation of electrical segment strength are important under mechanical loading or without one as well as thermal stress. In this study, a new arrangement of the Micro channel heat sink was proposed based on the constructal theory to examine two aspects of mechanically (for the first time) and thermal. At first radial design configuration is considered then first reverting channels is designed and investigated. Then it is shown that second and third reverting channel improved uniformly of temperature and mechanical strength. To finding the best place for third channels to deacreasing maximum temperature and increasing mechanical strength, best second channels has been fixed. After that the best place for third reverting channels was founded. It should be noted that thevolume fraction of Micro channels was fixed and it is equal 5 percent of disks volume. Micro channels and reverting channels are designed base on dimension from previous study. The study has shown that there is a close relationship between the maximum temperature and maximum tension in the piece (maximum temperature and maximum stress decreases in pieces with more uniform distribution channel). The proposed structure has increased the maximum surface temperature and maximum thermal stresses up to 35 and 50 %, and also decreased mechanical strength with taking into account thermal 24%. In this study the effect of reverting channels designed has been shown to the temperature distribution will be more uniformly rather than without reverting channels. Also, it has been proved that the reverting channels causes raising mechanical strength at any conditions. And raising the reachability of flow to a background (electronic device) causes to uniformly distribution of temperature and mechanical strength. Results have been shown that using revertin channel raise needed pressure to flow cooling fluid in micro channels because they will be thinner than radial design. also if number of reverting channels get more the needed pressure will be increase. Eventully, the design with third reverting channels is the best design to cooling electronic device Keywords: Constructal Theory, Cooling Disc, Thermal Stress, FSI, Reverting channel, Radial Channel